NVision 40 Ar
- Ga ion beam (2 - 30 kV) for nano structuring and cutting
- Electron beam (0.5 - 30 kV) for imaging using inlens, SE2, BSE and other detectors
- Gas injection system (GIS) to create nano-sized contacts, insulators and protection layers
- EDX system for element analysis
- 3D volume inspection by slice-and-view
- TEM lamella sample preparation